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Location

Department of Electrical & Computer Engineering

Physical Address:

Buchanan Engineering (BEL) 213
875 Perimeter Drive MS 1023
Moscow, ID 83844-1023

Phone: 208-885-6554

Fax: 208-885-7579

Email: ece-info@uidaho.edu

Staff

Feng Li, Ph.D., P.E.

Micron Endowed Chair in Microelectronics, NGeM Director, FIB/SEM Director

Gauss-Johnson 217

208-885-7571

fengli@uidaho.edu

Campus: Moscow
Classes: Microelectronics I, Microelectronics I Lab, Electromagnetic Theory, Electromagnetics Lab, Signals and Systems I, Signals and Systems I Lab, Introduction to Electronic Packaging, Introduction to VLSI Design, Semiconductor Devices, Introduction to Microelectronics Fabrication, Senior Design I, Senior Design II
Areas of Expertise: Semiconductor device and IC design, Micro/nanofabrication and electronic packaging, ML/AI in VLSI design and manufacturing

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Mark F. Roll, Ph.D., P.E.

NGeM Outreach Manager, Clinical Faculty

McClure Hall 407C

mroll@uidaho.edu

Campus: Moscow
Courses: First Year Engineering, Elements of Materials Science, Aerospace Materials
Focus Areas: Engineering Sustainability, Microelectronics Packaging, Polymers and Composites

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Buddhi Lamsal, Ph.D.

NGeM Cleanroom Manager, Postdoctoral Fellow

Gauss-Johnson Building 209

buddhi@uidaho.edu

Reserach Areas: Semiconductor Thin Films and Devices, IC Design and Electronics Packaging, PVD Technology, Energy conversion/storage materials and devices

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Location

Department of Electrical & Computer Engineering

Physical Address:

Buchanan Engineering (BEL) 213
875 Perimeter Drive MS 1023
Moscow, ID 83844-1023

Phone: 208-885-6554

Fax: 208-885-7579

Email: ece-info@uidaho.edu